000			01318nac a22003131u 4500
010			_a 93009709
020			_a0471594369 (alk. paper) :
082	0	0	_a621.381046 _bPEC
090			_c6051 _d6051
100			_aPecht, Michael.[ed.]
245	0	0	_aQuality conformance and qualification of microelectronic packages and interconnects / _cedited by Michael Pecht ... [et al.].
260			_aNew York : _bWiley,c1994. _cc1994.
300			_axxxiii, 461 p. : _bill. ; _c25 cm.
500			_a"A Wiley-Interscience publication."
500			_aDistributer: Al-Ahram.
504			_aIncludes bibliographical references (p. 419-450) and index.
511			_aCatalogued By: Mahitab.
650		0	_aElectronic packaging _xDefects.
650		0	_aElectronic packaging _xQuality control.
650		0	_aElectronic packaging _xTesting.
650		0	_aQuality assurance.
700	1		_aDasgupta, Abhijit.
700	1		_aEvans, John W.
700	1		_aEvans, Jillian Y.
856	4	2	_3Contributor biographical information _uhttp://www.loc.gov/catdir/bios/wiley041/93009709.html
856	4	2	_3Publisher description _uhttp://www.loc.gov/catdir/description/wiley032/93009709.html
856	4	2	_3Table of Contents _uhttp://www.loc.gov/catdir/toc/onix03/93009709.html
942			_cBB _k621.381046PEC
999			_c6051 _d6051