01406nac a22003251u 4500010001600000020003000016082002000046090001500066100003400081245012900115260003700244300003700281500004000318500002700358504006400385511002800449650003500477650004300512650003500555650002300590700002300613700001900636700002200655856009600677856008800773856007400861942002200935999001500957952010800972  a   93009709  a0471594369 (alk. paper) :00a621.381046bPEC  c6051d6051  aPecht, Michael.[ed.]         00aQuality conformance and qualification of microelectronic packages and interconnects /cedited by Michael Pecht ... [et al.].  aNew York :bWiley,c1994.cc1994.  axxxiii, 461 p. :bill. ;c25 cm.  a"A Wiley-Interscience publication."  aDistributer: Al-Ahram.  aIncludes bibliographical references (p. 419-450) and index.  aCatalogued By: Mahitab. 0aElectronic packagingxDefects. 0aElectronic packagingxQuality control. 0aElectronic packagingxTesting. 0aQuality assurance.1 aDasgupta, Abhijit.1 aEvans, John W.1 aEvans, Jillian Y.423Contributor biographical informationuhttp://www.loc.gov/catdir/bios/wiley041/93009709.html423Publisher descriptionuhttp://www.loc.gov/catdir/description/wiley032/93009709.html423Table of Contentsuhttp://www.loc.gov/catdir/toc/onix03/93009709.html  cBBk621.381046PEC  c6051d6051  00104070aMAINbMAINc1STd2012-11-07ePurchasel0o621.381046PECp000007681r2025-07-15 00:00:00yBB