TY  - GEN
AU  - Pecht, Michael.[ed.]         
AU  - Dasgupta,Abhijit
AU  - Evans,John W.
AU  - Evans,Jillian Y.
TI  - Quality conformance and qualification of microelectronic packages and interconnects
SN  - 0471594369 (alk. paper) :
U1  - 621.381046 
PY  - 1994///
CY  - New York
PB  - Wiley,c1994.
KW  - Electronic packaging
KW  - Defects
KW  - Quality control
KW  - Testing
KW  - Quality assurance
N1  - "A Wiley-Interscience publication."; Distributer: Al-Ahram; Includes bibliographical references (p. 419-450) and index; Catalogued By: Mahitab
UR  - http://www.loc.gov/catdir/bios/wiley041/93009709.html
UR  - http://www.loc.gov/catdir/description/wiley032/93009709.html
UR  - http://www.loc.gov/catdir/toc/onix03/93009709.html
ER  -