01318nac a22003131u 4500 93009709 0471594369 (alk. paper) : 621.381046 PEC 6051 6051 Pecht, Michael.[ed.] Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... [et al.]. New York : Wiley,c1994. c1994. xxxiii, 461 p. : ill. ; 25 cm. "A Wiley-Interscience publication." Distributer: Al-Ahram. Includes bibliographical references (p. 419-450) and index. Catalogued By: Mahitab. Electronic packaging Defects. Electronic packaging Quality control. Electronic packaging Testing. Quality assurance. Dasgupta, Abhijit. Evans, John W. Evans, Jillian Y. Contributor biographical information http://www.loc.gov/catdir/bios/wiley041/93009709.html Publisher description http://www.loc.gov/catdir/description/wiley032/93009709.html Table of Contents http://www.loc.gov/catdir/toc/onix03/93009709.html BB 621.381046PEC 6051 6051 0 0 0 0 MAIN MAIN 1ST 2012-11-07 Purchase 0 621.381046PEC 000007681 2025-07-15 00:00:00 BB