TY  - BOOK
AU  - Iyer,Subramanian S.
AU  - Auberton-Hervé,Andre J.
ED  - Institution of Electrical Engineers,
ED  - INSPEC.
TI  - Silicon wafer bonding technology: for VLSI and MEMS applications 
T2  - EMIS processing series
SN  - 0852960395
U1  - 621.38152 22
PY  - 2002///]
CY  - London, United Kingdom
PB  - INSPEC
KW  - Silicon-on-insulator technology
KW  - BUEsh
KW  - Integrated circuits
KW  - Very large scale integration
KW  - Microelectromechanical systems
KW  - GGEN
KW  - August2020
KW  - Reading book
N1  - Includes glossary; Includes appendices; Includes bibliographical references and index
UR  - http://www.loc.gov/catdir/toc/fy0705/2006284940.html
UR  - http://www.loc.gov/catdir/enhancements/fy0651/2006284940-d.html
ER  -