01811cam a22004337a 4500 28634 28605 14608498 EG-ScBUE 20200831134942.0 061024t2002 enka f bd 001 0 eng d 0852960395 (OCoLC)ocm48026089 UKM eng rda UKM CUS TXA OCLCQ OCL BAKER DLC EG-ScBUE 621.38152 SIL 22 Silicon wafer bonding technology : for VLSI and MEMS applications / edited by Subramanian S. Iyer, IBM microelectronics division, Hopewell Junction, USA and Andre J. Auberton-Hervé, SOITEC, France. London, United Kingdom : INSPEC, [2002] c2002 xxv, 149 pages : illustrations ; 26 cm. rdacontent text txt rdamedia unmediated n rdacarrier volume nc EMIS processing series ; 1 Includes glossary. Includes appendices. Includes bibliographical references and index. Silicon-on-insulator technology. BUEsh Integrated circuits Very large scale integration. BUEsh Microelectromechanical systems. BUEsh GGEN August2020 Reading book 34232 Iyer, Subramanian S., editor. 17864 Auberton-Hervé, Andre J., editor. Institution of Electrical Engineers, editor. INSPEC. EMIS Group. Table of contents only http://www.loc.gov/catdir/toc/fy0705/2006284940.html Publisher description http://www.loc.gov/catdir/enhancements/fy0651/2006284940-d.html 7 cbc copycat 2 ncip 20 y-gencatlg ddc BB 0 0 ddc 0 0 Baccah MAIN MAIN 1ST 2020-08-31 Purchase 0 621.38152 SIL 000049521 2025-07-15 00:00:00 2020-08-31 BB