Silicon wafer bonding technology : for VLSI and MEMS applications / edited by Subramanian S. Iyer, IBM microelectronics division, Hopewell Junction, USA and Andre J. Auberton-Hervé, SOITEC, France.

Contributor(s):

Material type:

TextSeries: EMIS processing series ; 1Publisher: London, United Kingdom : INSPEC, [2002]Copyright date: c2002Description: xxv, 149 pages : illustrations ; 26 cmContent type:

text

Media type:

unmediated

Carrier type:

volume

ISBN:

0852960395

Subject(s):

Genre/Form:

-- Reading book

DDC classification:

621.38152 SIL 22

Online resources:

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Holdings
Cover image	Item type	Current library	Home library	Collection	Shelving location	Call number	Materials specified	Vol info	URL	Copy number	Status	Notes	Date due	Barcode	Item holds	Item hold queue priority	Course reserves
	Book - Borrowing	Central Library First floor		Baccah		621.38152 SIL (Browse shelf(Opens below))					Available			000049521

Total holds: 0

Includes glossary.

Includes appendices.

Includes bibliographical references and index.

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Silicon wafer bonding technology : for VLSI and MEMS applications / edited by Subramanian S. Iyer, IBM microelectronics division, Hopewell Junction, USA and Andre J. Auberton-Hervé, SOITEC, France.

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