Quality conformance and qualification of microelectronic packages and interconnects /

Pecht, Michael.[ed.]

Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... [et al.]. - New York : Wiley,c1994. c1994. - xxxiii, 461 p. : ill. ; 25 cm.

"A Wiley-Interscience publication." Distributer: Al-Ahram.

Includes bibliographical references (p. 419-450) and index.

Catalogued By: Mahitab.

0471594369 (alk. paper) :

93009709


Electronic packaging--Defects.
Electronic packaging--Quality control.
Electronic packaging--Testing.
Quality assurance.

621.381046 / PEC