<?xml version="1.0" encoding="utf-8" ?> <rss version="2.0" xmlns:opensearch="http://a9.com/-/spec/opensearch/1.1/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom"> <channel> <title> <![CDATA[BUE Library Search for '(su:{Electronics}) AND (su:{Materials.})']]> </title> <!-- prettier-ignore-start --> <link> https://opac.bue.edu.eg//cgi-bin/koha/opac-search.pl?q=ccl=%28su%3A%7BElectronics%7D%29%20AND%20%28su%3A%7BMaterials.%7D%29&#38;sort_by=relevance&#38;format=rss </link> <!-- prettier-ignore-end --> <atom:link rel="self" type="application/rss+xml" href="https://opac.bue.edu.eg//cgi-bin/koha/opac-search.pl?q=ccl=%28su%3A%7BElectronics%7D%29%20AND%20%28su%3A%7BMaterials.%7D%29&#38;sort_by=relevance&#38;format=rss" /> <description> <![CDATA[ Search results for '(su:{Electronics}) AND (su:{Materials.})' at BUE Library]]> </description> <opensearch:totalResults>11</opensearch:totalResults> <opensearch:startIndex>0</opensearch:startIndex> <opensearch:itemsPerPage>50</opensearch:itemsPerPage> <atom:link rel="search" type="application/opensearchdescription+xml" href="https://opac.bue.edu.eg//cgi-bin/koha/opac-search.pl?q=ccl=%28su%3A%7BElectronics%7D%29%20AND%20%28su%3A%7BMaterials.%7D%29&#38;sort_by=relevance&#38;format=opensearchdescription" /> <opensearch:Query role="request" searchTerms="q%3Dccl%3D%2528su%253A%257BElectronics%257D%2529%2520AND%2520%2528su%253A%257BMaterials.%257D%2529" startPage="" /> <item> <title> Smart electronic materials : fundamentals and applications / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=2728</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Singh, Jasprit. .<br /> Cambridge : Cambridge University Press,2005. 2005 .<br /> xxii, 408 p. : 26 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=2728</guid> </item> <item> <title> Electronic materials and processes handbook / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=5986</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Harper, Caharles A.[ed .<br /> New York : McGraw-Hill,c1994. 1994 .<br /> 1 v. (various pagings) : , Cover title: Electronic materials &amp; processes handbook. 24 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=5986</guid> </item> <item> <title> Materials and devices for electrical engineers and physicists / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=6616</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Colclaser, Roy A. .<br /> New York : McGraw-Hill,1985 1985 .<br /> xiv, 284 p. : , distributer: Al-Ahram 25 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=6616</guid> </item> <item> <title> Electronic engineering materials and devices / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=9661</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Allison, John. .<br /> New Delhi, | New York, Tata McGraw-Hill, c.1971. 1971 .<br /> xii, 302 p. , Distributer:Al-Ahram. 24 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=9661</guid> </item> <item> <title> A text book of Electrical engineering materials and electronic components : (Including non Electronical Enginering Materials ) / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=9676</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Raina, K. B. .<br /> Delhi : S. K. Kataria &amp; Sons,2005. 2005 .<br /> xi, 240 p.; , Distributer: Al-Ahram | Includes index. 24 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=9676</guid> </item> <item> <title> Electronic Materials and Processes Handbook / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=10538</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> New York : McGraw-Hill, 2003 .<br /> 1 v. (various pagings) : 25 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=10538</guid> </item> <item> <title> Handbook of superconducting materials,V1. / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=11700</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> Bristol ; | Philadelphia : Institute of Physics Pub., 2003 .<br /> 2 v. : , Including index. 25 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=11700</guid> </item> <item> <title> Adhesives, sealants, and coatings for the electronics industry / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=11797</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Flick, Ernest W..<br /> Park Ridge, N.J. : Noyes Publications, 1992 .<br /> xxx, 1002 p. ; , Includes index. 24 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=11797</guid> </item> <item> <title> Nanoelectronics and Information Technology : Advanced Electronic Materials and Novel Devices / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=16153</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> Weinheim : Wiley-VCH, 2005 2005 .<br /> 995 p. : 29 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=16153</guid> </item> <item> <title> Metamaterials : critique and alternatives / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=20766</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Munk, Ben.<br /> Hoboken : John Wiley &amp; Sons, 2009 .<br /> xviii, 189 p. : , Index : p. 185-189. 25 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=20766</guid> </item> <item> <title> Advanced electrical and electronics materials / </title> <dc:identifier>ISBN:</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=23683</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Gupta, K. M.,.<br /> New Delhi : Wiley India Pvt.Ltd., 2015 .<br /> xlii, 716 p. : , Index : p. 709-716. 24 cm..<br /> </p> ]]> </description> <guid>https://opac.bue.edu.eg//cgi-bin/koha/opac-detail.pl?biblionumber=23683</guid> </item> </channel> </rss>
